Global Advanced Semiconductor Packaging Market : Industry Analysis and Forecast (2019-2026)

Global Advanced Semiconductor Packaging Market was valued US$ XX Bn in 2018 and is expected to reach US$ XX Bn by 2026, at a CAGR of around 11.3% during a forecast period.

Advanced semiconductor packaging prevents physical damage and corrosion of the chips that are to be connected to the circuit boards. In the recent years, semiconductor packaging has evolved giving increase to advanced semiconductor packaging technologies.

Advanced semiconductor packaging market report studied, analyzed and presented the major trends that will impact the industry and competitive landscape of the advanced semiconductor packaging market. The latest key trend gaining momentum in the market is changing in wafer size. The rapid technological advancements in wafer processing have always been a vital challenge faced by a vendor and are hindering the growth of the global market for advanced semiconductor packaging. The industry is focusing on producing larger diameter wafers which in turn are likely to cut down the manufacturing costs.

The report on global advanced semiconductor packaging market covers segments such as packaging type, application and region. Based on the packaging type, the flip-chip packaging technology segment accounted for the major XX% shares of the semiconductor advanced packaging market. Factors such as the expanding shipment of mobile devices and the high adoption of 2.5D/3D ICs in almost all electronic devices will contribute to the growth of this industry segment in the upcoming years.
Region-wise, The APAC is projected to witness the fastest growth during the forecast period. Likewise, such growth can be attributed to the presence of prominent semiconductor manufacturing companies present in the region which are driving the demand for advanced semiconductor packaging. Moreover, companies are also seen investing heavily in the R&D of new semiconductor packages with advanced features.

Indian Government has deployed enterprises such as Preferential Market Access (PMS), Electronics Manufacturing Clusters (EMC), and Modified Special Incentive Package Scheme (M-SIPS) in order to achieve a degree of sufficiency in electronics, which will push the advanced semiconductors packaging market beyond restrictions, as semiconductor devices are one of the main components of electronic gadgets.

In 2013, ASE group, a supplier of independent semiconductor manufacturing services in testing and assembly, hit a roadblock. Various claimed that ASE disposed wastewater with high acidity levels in a water body near the NEPZ, where it runs 12 facilities, and therefore received 48 environmental penalties. However, in 2016, the Kaohsiung High Administrative Court revoked penalties forced by the Kaohsiung City Government’s Environmental Protection Bureau. Since then, ASE invested millions to recycle wastewater from its Kaohsiung operations and made the water-recycling plant. The company further installed ultra-efficient lighting & heating, ventilation and air-conditioning systems and received the 2016 (AREA) Asia Responsible Entrepreneurship Award in the Social Empowerment category.

The reports cover detail key developments in the advanced semiconductor packaging market as organic and inorganic growth strategies. Many companies are focusing on organic growth strategies such as product launches, product approvals and others like patents and events. Inorganic growth strategies activities witnessed in the advanced semiconductor packaging market were acquisitions and partnership & collaborations.

The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding Global Advanced Semiconductor Packaging Market dynamics, structure by identifying and analyzing the market segments and project the global market size. Further, the report also focuses on the competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence. The report also provides PEST analysis, PORTER’s analysis, and SWOT analysis to address the question of shareholders to prioritizing the efforts and investment shortly to the emerging segment in the Global Advanced Semiconductor Packaging Market.
Scope of the Global Advanced Semiconductor Packaging Market

Global Advanced Semiconductor Packaging Market, by Packaging Type

• FO WLP
• 2.5D/3D
• FI WLP
• Flip Chip
Global Advanced Semiconductor Packaging Market, by Application

• Automotive
• Aerospace and Defense
• Medical Devices
• Consumer Electronics
• Other
Global Advanced Semiconductor Packaging Market, by Region

• North America
• Europe
• Asia Pacific
• Middle East & Africa
• South America
Key players operating in the Global Advanced Semiconductor Packaging Market

• AMD
• Intel Corp
• Amkor Technology
• STMicroelectronics
• Hitachi Chemical
• Infineon
• Avery Dennison
• Sumitomo Chemical
• ASE Group
• Kyocera
• China Wafer Level CSP
• ChipMOS TECHNOLOGIES
• FlipChip International
• HANA Micron
• Interconnect Systems (Molex)
• Jiangsu Changjiang Electronics Technology (JCET)
• King Yuan Electronics
• Tongfu Microelectronics
• Nepes
• Powertech Technology (PTI)
• SIGNETICS
• Tianshui Huatian
• Ultratech
• UTAC.

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